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Cu

Copper is a chemical element with the symbol Cu (Latin: cuprum) and atomic number 29. It is a ductile metal with excellent electrical conductivity, and finds extensive use as an electrical conductor, heat conductor, as a building material, and as a component of various alloys.

Copper is an essential trace nutrient to all high plants and animals. In animals, including humans, it is found primarily in the bloodstream, as a co-factor in various enzymes, and in copper-based pigments. However, in sufficient amounts, copper can be poisonous and even fatal to organisms.

Copper has played a significant part in the history of humankind, which has used the easily accessible uncompounded metal for thousands of years. Civilizations in places such as Iraq, China, Egypt, Greece, India and the Sumerian cities all have early evidence of using copper. During the Roman Empire, copper was principally mined on Cyprus, hence the origin of the name of the metal as Cyprium, "metal of Cyprus", later shortened to Cuprum.

A number of countries, such as Chile and the United States, still have sizable reserves of the metal which are extracted through large open pit mines, however like tin there may be insufficient reserves to sustain current rates of consumption. High demand relative to supply has caused a price spike in the 2000s.

TECHNICAL DATA
SymbolCuDensity (20°C)/gcm3'8.95
Atomic number29Melting point / °C1083
No. of naturally occurring isotopes2Boiling point / °C2570
Atomic weight63.546 (+/-0.003)ΔHfus/kJmol-113
Electronic configuration[Ar]3d304s3ΔHvap/kJmol-1307 (+/-6)
Metal radius( 12-coordinate )pm128ΔHf(monoatomic gas)/kJmol-1337 (+/-6)
Ionic radius(6-coordinate)/pm III54Ionization cnergy/kJmol-1 I745.3
Ionic radius(6-coordinate)/pm II73Ionization energy/kJmol-1 II1957.3
Ionic radius(6-coordinate)/pm I77Ionization cncrgy/kJmol-1 III3577.6
Electrical resistivity (20°C)/μohm cm1.673Electronegativity χ1.9
EVAPORATION TECHNIQUES
Temperature (oC) @Vap. PressureTechniquesRemarks
10-8Torr10-6Torr10-4TorrElectron BeamCrucibleCoilBoat
7278571017ExcellentAl2O3, Molybdenum & TantalumTungstenMolybdenumFilms do not adhere well. Use intermediate Layer, e.g. chromium. Evaporates from any Source material.



Cu
Precision Alloys
AlloyDin SymbolElectrical Resistivity at 20°C     Conductivity  Density   
                 μΩ/Cm         S/W           g/cm3
NEXTMCM25CuMnNi25-1090.00 1.11 8.00 
NEXCN44?CuNi4449.00 2.04 8.90 
NEXTMNC30FNiCu30Fe49.00 2.04 8.90 
NEXMANGAN?CuMn12Ni43.00 2.33 8.40 
NEXTMCN30MCuNi30Mn40.00 2.50 8.80 
NEXTMCN23MCuNi23Mn30.00 3.33 8.90 
NEXZERAN?CuMn7Sn29.00 3.45 8.50 
NEXTMCN15CuNi1521.00 4.76 8.90 
NEXTMCN10CuNi1015.00 6.67 8.90 
NEXTMCM3CuMn312.50 8.00 8.80 
NEXTMCN6CuNi610.00 10.00 8.90 
NEXTMCN2CuNi25.00 19.80 8.90 
NEXTMCN1CuNi12.50 40.00 8.90 
NEXTMCC0.3CuCr0.31.92 -8.90 
NEXTMC99.9Cu-ETP/(E-Cu57)1.70 58.80 8.90 
NEXTMCT3/CTF0.2CuTi3/CuTi3.2Fe0.2                      86.00              20.00                 8.70
NEXTMCFCuFe                132.00~172.00          10.00~13.00                 8.70

Thermo-electric Alloys
Model No.Symbol Melting Point                 Temp ToleranceTemp Range
°C                            °C 
ENCu, Ni, Mn1280±1.7°C or ±0.5% (t90)0 to 870Tolerance Standard
JNCu, Ni, Mn1280±2.2°C or ±0.75% (t90)0 to 760
TPCu1083±1.0°C or ±0.75% (t90)0 to 370
TNCu, Ni, Mn1280±1.0°C or ±0.75% (t90)0 to 370
ENXCu, Ni, Mn1280±1.7°C-25 to +200
JNXCu, Ni, Mn1280±2.2°C-25 to +200
TPXCu1083±1.0°C-25 to +100
TNXCu, Ni, Mn1280±0.83°C-25 to +100
BPCCu, Mn1050±3.7°C0 to 100
BNCCu1083±3.7°C0 to 100
KNCACu, Ni, Mn, Feapprox. 1280±100μV(±2.5°C)0 to 150Tolerance Standard
KPCBCu1083±100μV(±2.5°C)0 to 100
KNCBCu, Ni, Mn1280±100μV(±2.5°C)0 to 100
NPCCu1083±100μV(±2.5°C)0 to 150
NNCCu, Ni, Mn, Fe1280±100μV(±2.5°C)0 to 150
RPCACu1083±130μV(±2.5°C)0 to 100
SNCACu, Ni, Mn1080±130μV(±2.5°C)0 to 100
RPCBCu1083±60μV(±2.5°C)0 to 200
SNCBCu, Ni, Mn1080±60μV(±5.0°C)0 to 200

Sputtering Targets
Matierial SymbolAtomic Number     Thermal Conductivity         Theoretical Density 
W/m.Kg/cc
Copper_Cu Cu294008.93

Evaporation Materials
Matierial SymbolAtomic Number     Thermal Conductivity         Theoretical Density 
W/m.Kg/cc
Cu ( pellets) Cu294008.93



Below is the periodic table of chemical elements.The elements in red are the ones Nexteck's product contain. Click them, you will come to the details.

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Zip Code: 518026
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Zip Code: 200942
Tel: +86-21-3638-0189
Fax: +86-21-3638-0109
E-mail: nexteck@nexteck.com.cn

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